On October 15, 2026, TSMC reported third-quarter 2026 consolidated revenue of NT$1,494.24 billion, net income of NT$763.06 billion and diluted EPS of NT$29.43 (US$4.60 per ADR unit). Revenue rose 50.9 percent year over year in New Taiwan dollars, and net income and EPS each rose 68.7 percent. In US dollars, revenue was $46.72 billion, up 41.2 percent year over year and 16.2 percent from the second quarter. Gross margin was 66.4 percent, operating margin 58.7 percent and net profit margin 51.1 percent.
Advanced technologies (7-nanometer and below) made up 79 percent of wafer revenue, up from 77 percent in Q2. 2-nanometer reached 8 percent of wafer revenue, with 3-nanometer at 33 percent, 5-nanometer at 28 percent and 7-nanometer at 10 percent. On the earnings call, TSMC said its HPC platform, which includes AI accelerators, grew 22 percent sequentially to 68 percent of revenue.
TSMC guided fourth-quarter revenue to between US$52.3 billion and US$54.3 billion and said it now expects full-year 2026 revenue growth of about 44 percent in US dollars. It reiterated a 2026 capital budget of US$60 billion to US$64 billion, citing “continued robust multiyear demand from our customers, including the emerging agentic AI market.” Management described the AI market as “very strong,” pointing to the move from chatbots to AI assistants, wider adoption of open-source models and new demand for agentic AI CPUs and networking chips.
Why it matters: TSMC manufactures nearly every leading AI accelerator, so its results are the most direct read of how much AI silicon is actually being built. A quarter above the top of its own guidance, plus a raised full-year outlook, shows the AI hardware buildout still accelerating in late 2026.
What it does not show: TSMC does not break out AI accelerator revenue in the release, so the AI share of HPC is not disclosed. Revenue measures chips shipped to customers, not whether the data centers that buy them earn a return.